CVE-2025-21449

High CVSS: 7.5

Transient DOS may occur while processing malformed length field in SSID IEs.

Vendor

Product

CWE

Yayın Tarihi

2025-07-08 13:15:30

Güncelleme

2026-02-10 19:14:16

Source Identifier

product-security@qualcomm.com

KEV Date Added

CWE-126 Sm8635p Firmware HIGH Qualcomm 2025

https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html

High

CVE-2026-21385

Memory corruption while using alignments for memory allocation.

High

CVE-2025-59600

Memory Corruption when adding user-supplied data without checking available buffer space.

High

CVE-2025-59603

Memory Corruption when processing invalid user address with nonstandard buffer address.

High

CVE-2025-47385

Memory Corruption when accessing trusted execution environment without proper privilege check.

High

CVE-2025-47386

Memory Corruption while invoking IOCTL calls when concurrent access to shared buffer occurs.

High

CVE-2025-47381

Memory Corruption while processing IOCTL calls when concurrent access to shared buffer occurs.